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公开(公告)号:US20240215646A1
公开(公告)日:2024-07-04
申请号:US18572794
申请日:2021-10-13
发明人: Ping CHEN
IPC分类号: A24F40/465 , A24F40/10 , A24F40/485 , A24F40/57 , A24F40/95
CPC分类号: A24F40/465 , A24F40/10 , A24F40/485 , A24F40/95 , A24F40/57
摘要: An atomization assembly for use in an electromagnetic heating device, includes an atomization apparatus (10) and a heating apparatus (20). The atomization apparatus (10) comprises a magnetically conductive metal part (12). The heating apparatus (20) comprises, a circuit board (22), a power battery (23) and a coil assembly (24). The power battery (23) is connected to the coil assembly (24) by means of the circuit board (22). The coil assembly (24) is provided with an accommodating space (241). The magnetically conductive metal part (12) is located in the accommodating space (241). The present invention applies power battery (23) heating to the electronic atomization field, and the magnetically conductive metal part (12) requires no conductive lines connected thereto, and both the structural strength and the material of the magnetically conductive metal part (12) can be made with an optimal design and the utilization of thermal energy is made high.
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公开(公告)号:US20240180249A1
公开(公告)日:2024-06-06
申请号:US18552914
申请日:2021-06-03
发明人: Ping CHEN
CPC分类号: A24F40/46 , A24F40/10 , H05B3/0019 , H05B2203/021
摘要: Disclosed are a close-packed heating mechanism and an atomization device comprising the same. The close-packed heating mechanism includes heating circuits configured for evaporating liquid, and electrodes connected to a power supply unit. At least two heating circuits are disposed between the two electrodes in parallel to form a circuit group. The distance between adjacent heating circuits in the circuit group or the distance between at least parts of adjacent circuit groups is less than 0.5 mm to form a close-packed structure; or, the distance between at least parts of the adjacent heating circuits in the circuit group and the distance between at least parts of the adjacent circuit groups are less than 0.5 mm to form a close-packed structure; and the distance between other parts is greater than the distance in the close-packed structure. The atomization device includes a liquid transfer unit and the heating mechanism.
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3.
公开(公告)号:US20230363452A1
公开(公告)日:2023-11-16
申请号:US18029671
申请日:2021-07-23
发明人: Ping CHEN
摘要: An atomization assembly includes a heating assembly, a cover, a base and an electrode. The heating assembly includes a heating element and a support. A compartment is disposed on one of the cover and the base and is open towards the other one of the cover and the base. The heating assembly is disposed in the compartment. The heating element is transversely integrated with the top of the support to be supported by the support. The heating assembly is sandwiched between the cover and the base. The heating element includes a main part used for heating and atomizing liquid and an electrical connection part connected to the main part. The electrical connection part is bent from the top of the support to one side of the support. The electrode is in contact with the portion, bent to one side of the support, of the electrical connection part.
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4.
公开(公告)号:US20240349798A1
公开(公告)日:2024-10-24
申请号:US18035937
申请日:2022-01-21
发明人: Ping CHEN
摘要: A heating atomization assembly, a heating atomization device, and an electronic atomizer comprising the heating atomization device. The heating atomization assembly includes a liquid transfer unit and a heating unit. At least one liquid inflow surface is disposed on a side wall of the liquid transfer unit. The heating unit includes an embedded part and an atomization part The heating atomization device includes a sealing element, a base, and a heating atomization assembly disposed between the base and the sealing element. The electronic atomizer includes an atomizer shell. A heating atomization device is disposed in the atomizer shell, and a liquid storage chamber and an air guide tube are disposed between the atomizer shell and the heating atomization device. Liquid around the liquid inflow surface is preheated to reduce the viscosity of the liquid with a high viscosity and increase the flow rate of the liquid.
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公开(公告)号:US20240260672A1
公开(公告)日:2024-08-08
申请号:US18565505
申请日:2021-09-08
发明人: Ping CHEN
摘要: A porous ceramic liquid transfer unit comprises a ceramic body and a support portion extending downward from the ceramic body. The ceramic body comprises at least two protruding portions connected into a whole through a connecting portion. A liquid transfer channel is arranged in each of the protruding portions. The heating unit is attached to bottoms of the liquid transfer channels. An electronic atomization device comprises an atomizer housing. The porous ceramic atomization core is arranged in the atomizer housing. The support portion extends downward from the ceramic body to support the ceramic body, thus preventing the ceramic body from being fractured, and condensate formed on the support portion can be absorbed to be recycled; and multiple protruding portions are arranged on the ceramic body, and the liquid transfer channels are arranged in the protruding portions to feed liquid quickly to improve the liquid transfer efficiency, thus optimizing the atomization effect.
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公开(公告)号:US20220346449A1
公开(公告)日:2022-11-03
申请号:US17624247
申请日:2020-07-24
发明人: Ping CHEN
摘要: The disclosure provides a capillary liquid conducting and atomizing unit and an atomizing device. The capillary liquid conducting and atomizing unit includes a housing and an atomization assembly arranged in the housing; at least one liquid inlet is provided in a side of the atomization assembly, a capillary liquid absorbing channel communicating with the liquid inlet is provided between an inner side of the housing and the side where the liquid inlet is located; a length direction of the capillary liquid absorbing channel extends along a height direction of the side where the liquid inlet is located, and two opposite ends of the capillary liquid absorbing channel respectively extend towards an upper side and a lower side of the liquid inlet, to absorb liquid into the liquid inlet by capillary action. Thus, the liquid inlet is not required to be arranged at a bottom of the liquid storage reservoir.
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7.
公开(公告)号:US20240292894A1
公开(公告)日:2024-09-05
申请号:US17768479
申请日:2020-08-26
发明人: Ping CHEN
IPC分类号: A24F40/46 , A24F40/10 , A24F40/44 , A24F40/485 , H05B3/16
CPC分类号: A24F40/46 , A24F40/10 , A24F40/44 , A24F40/485 , H05B3/16 , H05B2203/007 , H05B2203/013 , H05B2203/021
摘要: A heating atomization core and assembly having a multi-core porous liquid-conducting material, including a porous liquid-conducting material body and an electrical heating track element attached to a bottom surface of the porous liquid-conducting material body. The electrical heating track element has multiple electrical heating regions, and multiple liquid-conducting holes are formed in the porous liquid-conducting material body and match the electrical heating regions in position and number. The heating atomization assembly comprises the heating atomization core. According to the heating atomization core and assembly, a single-core heating region is divided into multiple multi-core heating regions connected in series, so that heating is more uniform, and liquid can be evaporated and atomized more sufficiently; and the liquid-conducting material body is provided with an intermediate through hole, so that the whole heating atomization assembly is simpler in structure and easier to assemble.
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8.
公开(公告)号:US20240284976A1
公开(公告)日:2024-08-29
申请号:US18572801
申请日:2021-08-18
发明人: Ping CHEN
摘要: A liquid transfer unit for an atomization core is formed by stacking multiple layers of liquid transfer cloth. At least one side of at least one layer of liquid transfer cloth has grains, such that at least two adjacent layers of liquid transfer cloth are not completely attached to each other to form micro-grooves, and the micro-grooves are connected to form a liquid chamber. The heating atomization core comprises the liquid transfer unit and a heating unit attached to the liquid transfer unit, wherein the heating unit is connected to electrode leads. This can make that liquid stored in the liquid chamber can be supplied quickly to improve the liquid transfer efficiency, thus optimizing the atomization effect.
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公开(公告)号:US20240023615A1
公开(公告)日:2024-01-25
申请号:US18026598
申请日:2021-06-30
发明人: Ping CHEN
摘要: Disclosed is a heating mechanism for healing in stages, which comprises a heating circuit and electrodes; the heating circuit comprises a pre-heating portion buried within a liquid guide body, and an atomization portion fit on or inlaid in an atomization surface of the liquid guide body; the pre-heating portion and the atomization portion are connected in series and/or connected in parallel between electrodes the pre-heating portion and the atomization portion are stacked, causing projections thereof to completely or partially overlap; or the pre-heating portion and the atomization portion are arranged at high and low levels, causing projections thereof to not overlap; and at least the atomization portion is a complete structure, and the shape and size thereof match uniformly with the atomization surface of the liquid guide body.
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