公开(公告)号：US20240377760A1

公开(公告)日：2024-11-14

申请号：US18505041

申请日：2023-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwoong HWANG ,  Yongsuk CHOI ,  Yonghoon HWANG ,  Kyung-Won KANG ,  Dong-Wook KIM ,  Seok HEO

IPC: G03F7/00

Abstract: A photolithography apparatus according to an embodiment includes an exposure portion performing an exposure process, a plurality of track portions each performing a coating process and a developing process, and an interface portion connecting the exposure portion and the plurality of track portions to transfer a substrate on which a photolithography process is performed between the exposure portion and the plurality of track portions.