公开(公告)号：US20200058615A1

公开(公告)日：2020-02-20

申请号：US16533450

申请日：2019-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HWAIL JIN ,  YONGWON CHOI ,  MYUNG-SUNG KANG ,  YEONGSEOK KIM ,  WONKEUN KIM

IPC: H01L23/00 ,  H01L21/78

Abstract: A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.