公开(公告)号：US20240420930A1

公开(公告)日：2024-12-19

申请号：US18414681

申请日：2024-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changho Kim ,  Ho-Jun Lee ,  Kyung-Sun Kim ,  Sang-Woo Kim ,  Donghyeon Na ,  Seungbo Shim ,  Sung-Hyeon Jung

IPC: H01J37/32

Abstract: A substrate processing apparatus according to an embodiment includes: a chamber providing a processing space; a support member disposed in the processing space and configured to support a substrate during a process treatment; an antenna providing energy for plasma excitation into the processing space; and an inner electromagnet disposed outside the processing space.