公开(公告)号：US11325213B2

公开(公告)日：2022-05-10

申请号：US16769973

申请日：2018-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  HAN TECHNOLOGY CO., LTD.

Inventor： Minjae Kim ,  Ohsung Kwon ,  Youngjin Kim ,  Sangkyu Park ,  Sungkeun Park ,  Seungyeol Oh ,  Minwoo Lee ,  Jinhee Lee

IPC: B32B43/00 ,  B23P19/04

Abstract: According to various embodiments of the present invention, an electronic device comprises: a heating unit, which includes a lower heating unit and an upper heating unit rotatably coupled to the lower heating unit, and heats an external electronic device mounted on at least one surface of the lower heating unit; a fixing unit, which is disposed to be adjacent to the lower heating unit, and has at least one part formed to be movable in the longitudinal direction of the lower heating unit, thereby fixing the external electronic device; a adsorption unit having one part, which is inserted into at least one recess formed on the upper heating unit, and adsorbing at least a region of the external electronic device; and a driving unit, which is disposed at one side or a surrounding part of the heating unit, can move in the direction perpendicular to the moving direction of the fixing unit, and rotates the upper heating unit by pressurizing the same.

公开(公告)号：US20250052559A1

公开(公告)日：2025-02-13

申请号：US18620802

申请日：2024-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minhwan Seo ,  Jiyoung Chu ,  Hyungjin Kim ,  Sangwoo Bae ,  Seungyeol Oh

IPC: G01B9/02015 ,  G01B9/02001 ,  G01B11/27 ,  G02B27/28

Abstract: A parallelism measurement optical system module includes a polarization beam splitter, a mirror positioned on a first surface of the polarization beam splitter, a first quarter wave plate positioned on a second surface of the polarization beam splitter that is perpendicular to the first surface, and a second quarter wave plate positioned on a third surface of the polarization beam splitter that is perpendicular to the first surface and parallel to the second surface.

公开(公告)号：US20220208649A1

公开(公告)日：2022-06-30

申请号：US17479278

申请日：2021-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungyeol Oh ,  Hyuekjae Lee

IPC: H01L23/48 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L21/768 ,  H01L21/48

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip and including a through-silicon via electrically connecting a front pad and a rear pad, a dielectric layer having a first region covering a side surface of the second semiconductor chip and a second region filling space between the first semiconductor chip and the second semiconductor chip, a first through-via penetrating through the first region of the dielectric layer, and a second through-via penetrating through the second region of the dielectric layer.