公开(公告)号：US20240218297A1

公开(公告)日：2024-07-04

申请号：US18244336

申请日：2023-09-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DAESUNG CHUNG ,  HAYOUNG JEON ,  JI HOON CHA ,  MINGYU JAE ,  KYUNGHYUN KIM ,  SUNGHOON YOO

IPC: C11D3/37 ,  C11D3/20 ,  C11D3/43 ,  C11D11/00

CPC classification number: C11D3/3746 ,  C11D3/2082 ,  C11D3/43 ,  C11D11/0047

Abstract: A semiconductor cleaning composition includes: a hydrophobic polymer, an organic acid; and a solvent, wherein the hydrophobic polymer includes a first allotrope and a second allotrope, wherein the first allotrope is nonpolar, wherein the second allotrope is polar, and wherein the second allotrope is about 5% to about 20% of the hydrophobic polymer.