Abstract:
A wet etching apparatus includes a process bath having an internal space configured to receive an etchant and having a support unit, on which a wafer is disposed to be in contact with the etchant. A laser unit is disposed above the process bath and is configured to direct a laser beam to the wafer and to heat the wafer thereby. An etchant supply unit is configured to supply the etchant to the internal space of the process bath.
Abstract:
A method of generating tessellation data include analyzing patch data of each of a plurality of patches; generating shared data that is shared by the patches, non-shared data that are not shared by the patches, and attribute data on an attribute of control points of each of the patches from the patch data according to a result of the analyzing; and compressing the non-shared data and the attribute data.
Abstract:
A tessellation method includes determining whether a previous tag the same as a current tag of a current patch is stored in a cache, and transmitting a previous tessellation pattern corresponding to the previous tag stored in the cache to a domain shader when a cache hit occurs. The method may further include, when a cache miss occurs, generating a current tessellation pattern corresponding to the current patch using a tessellator and transmitting the generated current tessellation pattern to the domain shader, and storing the generated current tessellation pattern in the cache.