公开(公告)号：US20230375452A1

公开(公告)日：2023-11-23

申请号：US18180533

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hansung RYU ,  Haksung KIM ,  Gyunghwan OH ,  Heonsu KIM ,  Dongwoon PARK ,  Jeonghyeon BAEK

IPC: G01N11/00

CPC classification number: G01N11/00 ,  G01N2011/0013 ,  G01N2011/0093 ,  G01N2011/008 ,  G01N2011/0066

Abstract: An apparatus for measuring properties of a thermosetting polymer includes a body having a first chamber and a second chamber each filled with the thermosetting polymer material. A first FBG sensor is disposed in the polymer material within the first chamber and a second FBG sensor is disposed in the polymer material within the second chamber. A first dielectric constant sensor is in the first chamber, and a second dielectric constant sensor is in the second chamber. A computing device is configured to measure properties of the thermosetting polymer based on wavelength data measured using the first FBG sensor and the second FBG sensor, and a loss coefficient of the polymer material measured using the first dielectric constant sensor and the second dielectric constant sensor, while the thermosetting polymer solidifies in the first chamber and the second chamber.