公开(公告)号：US20220181376A1

公开(公告)日：2022-06-09

申请号：US17382777

申请日：2021-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEOKHA LEE ,  JUNETAEG LEE

IPC: H01L27/146

Abstract: Provided is an image sensor including a sensor chip including a first substrate and a first interconnection layer, a logic chip including a second substrate and a second interconnection layer, a through-hole penetrating a portion of the second interconnection layer, the first substrate, and the first interconnection layer, and a first connection structure disposed on an inner surface of the through-hole and extending from the first substrate toward the second interconnection layer, wherein the first interconnection layer includes a first interlayer insulating layer and a first interconnection pattern, the second interconnection layer includes a second interlayer insulating layer and a second interconnection pattern, the through-hole includes first and second trenches respectively extending from the through-hole toward the second interconnection layer, bottom surfaces of the first and second trenches contact the second interconnection pattern, and a bottom surface of the through-hole contacts the first interconnection pattern.

公开(公告)号：US20220109014A1

公开(公告)日：2022-04-07

申请号：US17350543

申请日：2021-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghyun SONG ,  JUNETAEG LEE

IPC: H01L27/146

Abstract: Disclosed is an image sensor including a first substrate having first and second surfaces opposite to each other and including a pixel array area that includes unit pixel regions, a pad area that surrounds the pixel array area, and an optical black area between the pixel array area and the pad area, a dielectric pattern on the first surface of the first substrate, and a light-shield pattern on a top surface of the dielectric pattern on the optical black area. The first substrate includes first and second trenches recessed from the first surface. The dielectric pattern includes a first part filling the first trench and defining the unit pixel regions, a second part filling the second trench, and a third part on the first surface of the first substrate and connected to the first and second parts.