公开(公告)号：US20250037486A1

公开(公告)日：2025-01-30

申请号：US18668890

申请日：2024-05-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinwoo LEE ,  Bumjoo LEE ,  Jongcheon SUN ,  Suyoung LEE ,  Hyeongcheol LEE

IPC: G06V20/69 ,  G06T7/00 ,  G06V10/764

Abstract: A method of generating a defect classification model includes preparing a sample wafer that has undergone at least one unit of a manufacturing process, capturing, using an electronic device, a plurality of primary images of different locations of the sample wafer, obtaining a plurality of secondary images based on the capturing of the plurality of primary images, detecting a plurality of defect images including a defect from among the plurality of primary images and the plurality of secondary images, classifying and labeling at least one of the plurality of defect images as defect data, and generating an automatic defect classification model based on the defect data.

公开(公告)号：US20230332954A1

公开(公告)日：2023-10-19

申请号：US18102514

申请日：2023-01-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeongcheol LEE ,  Minsu KIM ,  Jeongho AHN

IPC: G01J3/28 ,  H04N25/71 ,  G01N21/88 ,  G01J3/02

CPC classification number: G01J3/2823 ,  H04N25/71 ,  G01N21/8806 ,  G01J3/0291 ,  G01N21/956

Abstract: An apparatus for inspecting and measuring a semiconductor device includes a stage on which an object to be measured is provided, a detector configured to detect a spectral image from light reflected from the object to be measured, and a processor configured to generate a spectral matrix based on the spectral image detected by the detector, wherein detector includes a time delayed integration (TDI) sensor configured to detect the spectral image based on a TDI process.