公开(公告)号：US20220199670A1

公开(公告)日：2022-06-23

申请号：US17409888

申请日：2021-08-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyoung JANG ,  Seokho KIM ,  Eungkyu LEE

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor includes a sensor chip and a logic chip. The sensor chip includes a first substrate, an upper bonding layer, a first wiring layer, and the logic chip includes a second substrate, a lower bonding layer, a second wiring layer. The upper and lower bonding layers contact each other, with the upper bonding layer including an upper dielectric layer, an upper conductive pad, an upper shield structure, and an upper wiring line, and the lower bonding layer including a lower dielectric layer, a lower conductive pad, a lower shield structure, and a lower wiring line. The upper wiring line, upper conductive pad, and upper shield structure being one body, and the lower wiring line, lower conductive pad, and lower shield structure being one body, the upper and lower conductive pads overlap and contact each other, and the upper and lower wiring lines overlap and contact each other.