公开(公告)号：US20240234215A9

公开(公告)日：2024-07-11

申请号：US18139674

申请日：2023-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donggap SHIN ,  Yongin LEE ,  Wooyoung KIM ,  Bumki MOON ,  Jiwon MOON ,  Seungdae SEOK ,  Siwoong WOO ,  Byeongtak PARK

IPC: H01L21/66 ,  H01L23/00

CPC classification number: H01L22/12 ,  H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/8001 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2924/401

Abstract: An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.

公开(公告)号：US20240136231A1

公开(公告)日：2024-04-25

申请号：US18139674

申请日：2023-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donggap SHIN ,  Yongin LEE ,  Wooyoung KIM ,  Bumki MOON ,  Jiwon MOON ,  Seungdae SEOK ,  Siwoong WOO ,  Byeongtak PARK

IPC: H01L21/66 ,  H01L23/00

CPC classification number: H01L22/12 ,  H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/8001 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2924/401

Abstract: An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.