公开(公告)号：US20210351797A1

公开(公告)日：2021-11-11

申请号：US17379461

申请日：2021-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

IPC: H04B1/00 ,  H01L23/498 ,  H01Q21/00 ,  H05K1/02

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

公开(公告)号：US11095318B2

公开(公告)日：2021-08-17

申请号：US16743478

申请日：2020-01-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

IPC: H04N1/44 ,  H04B1/00 ,  H01L23/498 ,  H01Q21/00 ,  H05K1/02

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.

公开(公告)号：US11955997B2

公开(公告)日：2024-04-09

申请号：US17379461

申请日：2021-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

IPC: H04B1/00 ,  H01L23/498 ,  H01Q21/00 ,  H05K1/02

CPC classification number: H04B1/005 ,  H01L23/49822 ,  H01Q21/0025 ,  H05K1/0243

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

公开(公告)号：US20210028797A1

公开(公告)日：2021-01-28

申请号：US16743478

申请日：2020-01-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

IPC: H04B1/00 ,  H01Q21/00 ,  H01L23/498 ,  H05K1/02

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.