公开(公告)号：US20180093917A1

公开(公告)日：2018-04-05

申请号：US15283673

申请日：2016-10-03

Applicant: Raytheon Company

Inventor： Michael Ushinsky ,  Sunder S. Rajan ,  Scott T. Turner ,  Isaac C. Chen

IPC: C03C8/14 ,  B28B3/00

CPC classification number: C03C8/14 ,  B28B3/00 ,  C01P2006/40 ,  C03C8/00 ,  C09C1/00 ,  C09C1/0009

Abstract: A molding composite includes mica flakes and a eutectic glaze. The composite allows making of lead-free parts for use in a variety of situations, such as electrical insulators for supporting electrically-conductive parts, such as electrodes, for electrical devices. The molded composite material can be used mold around such electrically-conductive parts, supporting them and/or providing hermetic seals around the parts. Other possible uses include substrates for electronic circuits, and housings for parts, such as electro-optical parts. The molding composite is heated under elevated pressure to liquefy the eutectic glaze, causing it to coat the mica flakes. After the composite is put into a desired shape it is solidify, for example by compressing the molding composite at a constant temperature until the eutectic glaze solidifies, followed by cooling of the molding composite.