公开(公告)号：US10606327B2

公开(公告)日：2020-03-31

申请号：US15624877

申请日：2017-06-16

Applicant: QUALCOMM Incorporated

Inventor： Victor Chiriac ,  Jorge Rosales ,  Peng Wang

IPC: H05K7/20 ,  H01L23/367 ,  G06F1/20 ,  G03B17/55

Abstract: Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.

公开(公告)号：US10405463B2

公开(公告)日：2019-09-03

申请号：US15625129

申请日：2017-06-16

Applicant: QUALCOMM Incorporated

Inventor： Jorge Rosales ,  Victor Chiriac ,  Jose Gilberto Corleto Mena

IPC: H05K7/20 ,  B64C39/02 ,  F28D15/02 ,  H05K1/02

Abstract: A quad-rotor or other unmanned aerial drone having a planar vapor chamber mounted to a processor of the drone to cool the processor. The processor may be enclosed in a protective central housing. The vapor chamber is mounted, in some examples, with a perimeter of the vapor chamber extending from the processor through the housing into an airflow region near the rotors of the drone so that airflow, which may include propeller wash, serves to cool the perimeter of the vapor chamber. The planar vapor chamber cools the enclosed processor using both phase-change cooling/heat spreading (i.e. heat is dissipated from the processor via evaporation and subsequent condensation) and convection (i.e. airflow passing over the perimeter of the vapor chamber carries heat away).

公开(公告)号：US10381562B1

公开(公告)日：2019-08-13

申请号：US15981931

申请日：2018-05-17

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis Rosales ,  Victor Chiriac ,  Sean Charles Andrews

IPC: H01L45/00

Abstract: Some features pertain to an apparatus that includes a first heat spreader and a second heat spreader, a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersects the second plurality of portions, and a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.

公开(公告)号：US20180049346A1

公开(公告)日：2018-02-15

申请号：US15236070

申请日：2016-08-12

Applicant: QUALCOMM Incorporated

Inventor： Victor Chiriac ,  Jorge Rosales ,  Jon Anderson ,  Stephen Molloy

IPC: H05K7/20 ,  H01L21/48 ,  H01L23/427 ,  G06F1/20 ,  H01L23/367

CPC classification number: H05K7/20309 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/0283 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H01L21/4882 ,  H01L23/3675 ,  H01L23/427 ,  H05K7/20318

Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

公开(公告)号：US20180042139A1

公开(公告)日：2018-02-08

申请号：US15226727

申请日：2016-08-02

Applicant: QUALCOMM Incorporated

Inventor： Jorge Rosales ,  Victor Chiriac

IPC: H05K7/20 ,  H01L23/427 ,  H05K1/02

CPC classification number: H05K7/20509 ,  H01L23/3672 ,  H01L23/3735 ,  H01L23/4275 ,  H05K1/0203 ,  H05K7/2029 ,  H05K7/20436 ,  H05K7/2099

Abstract: A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

公开(公告)号：US20180368290A1

公开(公告)日：2018-12-20

申请号：US15625129

申请日：2017-06-16

Applicant: QUALCOMM Incorporated

Inventor： Jorge Rosales ,  Victor Chiriac ,  Jose Gilberto Corleto Mena

IPC: H05K7/20 ,  B64C39/02 ,  B64D47/08 ,  H05K1/02 ,  F28D15/02

CPC classification number: H05K7/20881 ,  B64C39/024 ,  B64C2201/027 ,  B64C2201/127 ,  F28D15/0233 ,  H05K1/0203

Abstract: Some novel features pertain to a quad-rotor or other unmanned aerial drone having a planar vapor chamber mounted to a processor of the drone to cool the processor. The processor may be enclosed in a protective central housing. The vapor chamber is mounted, in some examples, with a perimeter of the vapor chamber extending from the processor through the housing into an airflow region near the rotors of the drone so that airflow, which may include propeller wash, serves to cool the perimeter of the vapor chamber. With this design, the planar vapor chamber cools the enclosed processor using both phase-change cooling/heat spreading (i.e. heat is dissipated from the processor via evaporation and subsequent condensation) and convection (i.e. airflow passing over the perimeter of the vapor chamber carries heat away). In some examples, the planar vapor chamber is turtle-shaped with legs aligned with the struts of the drone.

公开(公告)号：US09999157B2

公开(公告)日：2018-06-12

申请号：US15236070

申请日：2016-08-12

Applicant: QUALCOMM Incorporated

Inventor： Victor Chiriac ,  Jorge Rosales ,  Jon Anderson ,  Stephen Molloy

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/367 ,  H01L23/427 ,  H01L21/48

CPC classification number: H05K7/20309 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/0283 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H01L21/4882 ,  H01L23/3675 ,  H01L23/427 ,  H05K7/20318

Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

公开(公告)号：US09918407B2

公开(公告)日：2018-03-13

申请号：US15226727

申请日：2016-08-02

Applicant: QUALCOMM Incorporated

Inventor： Jorge Rosales ,  Victor Chiriac

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/427 ,  H01L23/473

CPC classification number: H05K7/20509 ,  H01L23/3672 ,  H01L23/3735 ,  H01L23/4275 ,  H05K1/0203 ,  H05K7/2029 ,  H05K7/20436 ,  H05K7/2099

Abstract: A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.