公开(公告)号：US20250103522A1

公开(公告)日：2025-03-27

申请号：US18473948

申请日：2023-09-25

Applicant: QUALCOMM Incorporated

Inventor： Hithesh Hassan LEPAKSHA ,  Sharath Kumar NAGILLA ,  Kalangi Fredy SUNDAR ,  Raveesh SINHA

IPC: G06F13/16 ,  G06F11/30 ,  G06F13/42

Abstract: Aspects relate to using memory access latency to mitigate thermal excesses in a System on a Chip (SOC). An apparatus includes a processing core, a memory, and thermal monitor configured to determine a thermal state of the processing core. A memory controller is coupled to the processing core, to the thermal monitor, and to the memory, and configured to provide the processing core with access to the memory, the memory controller further configured to delay access to the memory in response to the thermal state.