公开(公告)号：US20180067768A1

公开(公告)日：2018-03-08

申请号：US15257691

申请日：2016-09-06

Applicant: QUALCOMM INCORPORATED

Inventor： VAIBHAV BHALLA ,  KRISHNA VSSSR VANKA ,  MURALI DHULIPALA

IPC: G06F9/48

CPC classification number: G06F9/4893 ,  G06F1/203 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/3287 ,  G06F1/3293 ,  Y02D10/122 ,  Y02D10/171

Abstract: Methods and systems for data path aware thermal management in a portable computing device (“PCD”) are disclosed. A trigger event may be received at a thermal module in the PCD. The thermal module also receives thermal information about a plurality of processing components of the PCD in response to the trigger event, the thermal information including a temperature at the locations of the plurality of processing components. The thermal module also receives thermal information about at least one subsystem in response to the trigger event, the thermal information including temperature modeling information about the at least one subsystem and a second temperature at the location of the at least one subsystem. A thermal impact from the plurality of processing components executing a task over a period of time is predicted and a determination is made which processing component has the smallest amount of thermal impact from executing the task.