公开(公告)号：US20140262160A1

公开(公告)日：2014-09-18

申请号：US13842444

申请日：2013-03-15

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan VADAKKANMARUVEEDU ,  Mulugeta K. BERHE ,  Vinay MITTER ,  Ankur JAIN ,  Paras S. DOSHI

IPC: F28D15/02 ,  B23P15/26

CPC classification number: F28D15/02 ,  F28D2021/0028 ,  G06F1/203 ,  G06F2200/201 ,  H05K7/2029 ,  Y10T29/49359

Abstract: An apparatus for managing heat generated by at least one electronic component of a mobile device, the apparatus comprising: a housing for containing the electronic component of the mobile device; and a vapor chamber arranged in the housing, the vapor chamber having a cavity defined by a front wall and a rear wall opposite the rear wall, the front wall for receiving heat generated by the electronic component of the mobile device to evaporate fluid in the cavity into a vapor, the rear wall for receiving the vapor to allow the vapor to condense to liquid thereby cooling the rear wall of the vapor chamber; wherein an outer surface of the housing comprises at least a portion of the rear wall of the vapor chamber.

Abstract translation: 一种用于管理移动装置的至少一个电子部件产生的热量的装置，所述装置包括：用于容纳移动装置的电子部件的壳体; 以及布置在所述壳体中的蒸气室，所述蒸气室具有由前壁和与所述后壁相对的后壁限定的空腔，所述前壁用于接收由所述移动装置的电子部件产生的热量以使所述空腔中的流体蒸发 蒸汽，用于接收蒸汽的后壁，以允许蒸气冷凝至液体，从而冷却蒸气室的后壁; 其中壳体的外表面包括蒸气室的后壁的至少一部分。