POLISHING APPARATUS AND POLISHING METHOD
    1.
    发明申请

    公开(公告)号:US20200324383A1

    公开(公告)日:2020-10-15

    申请号:US16826487

    申请日:2020-03-23

    Abstract: A polishing apparatus is a polishing apparatus polishing a target object formed on a surface of a film-shaped substrate. A polishing apparatus includes: a rotatable polishing tool acting on the target object; a slurry nozzle supplying a polishing slurry; and a polishing stage pressing the polishing tool against the target object. A surface of the polishing stage has an unevenness shape.

    METHOD AND APPARATUS FOR MANUFACTURING FILM STRUCTURE

    公开(公告)号:US20200290264A1

    公开(公告)日:2020-09-17

    申请号:US16792620

    申请日:2020-02-17

    Abstract: A method for manufacturing a film structure includes: a positional deviation amount detection process of detecting an amount of positional deviation related to a relative position of a second cured film formed on a rear surface of a film with respect to a first cured film formed on a front surface of the film; a relative position adjustment process of correcting a position or a rotation speed of a second transfer roll to adjust the relative position such that the amount of positional deviation detected in the positional deviation amount detection process is reduced; a first tensile force detection process and a second tensile force detection process of respectively detecting a tensile force of the film between a first pressurizing roll and a second pressurizing roll before and after the relative position adjustment process; and a tensile force adjustment process of adjusting the tensile force of the film such that the tensile force of the film detected in the second tensile force detection process approaches the tensile force of the film detected in the first tensile force detection process.

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