-
公开(公告)号：US20200324383A1
公开(公告)日：2020-10-15
申请号：US16826487
申请日：2020-03-23
Inventor： YUJI YAMAMOTO , TORU FURUSHIGE
IPC: B24B37/04
Abstract: A polishing apparatus is a polishing apparatus polishing a target object formed on a surface of a film-shaped substrate. A polishing apparatus includes: a rotatable polishing tool acting on the target object; a slurry nozzle supplying a polishing slurry; and a polishing stage pressing the polishing tool against the target object. A surface of the polishing stage has an unevenness shape.
Search Results
1
records
(took 0.014 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
