公开(公告)号：US20230260959A1

公开(公告)日：2023-08-17

申请号：US18140206

申请日：2023-04-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tetsushi KONDA ,  Kenji KITAMURA ,  Takahito HAGIWARA ,  Ryo MATSUBAYASHI ,  Hidekazu UMEDA

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L2224/8384 ,  H01L23/3121

Abstract: A method for manufacturing a composite structure includes: an application step including providing a bonding material on a base member by applying a metal paste onto the base member; a preheating step including heating the bonding material before an element to be bonded is stacked on the bonding material and thereby drying the bonding material until a percentage of an organic component in the bonding material becomes 3% by mass and equal to or less than 8% by mass with respect to the bonding material; a mounting step including stacking the element to be bonded onto the bonding material and heating the bonding material to form a multi-layer stack; and a sintering step including sintering the bonding material by heating the multi-layer stack in a heating furnace and thereby forming the bonding layer.