公开(公告)号：US20240199903A1

公开(公告)日：2024-06-20

申请号：US17781117

申请日：2020-12-14

Applicant: POSTECH Research and Business Development Foundation

Inventor： Unyong JEONG ,  Veerapandian SELVARAJ

IPC: C09D11/52 ,  C09D11/033 ,  C09D11/106

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/106

Abstract: Disclosed are conductive liquid metal microparticles including a hydrogen-doped liquid metal oxide, a conductive ink including same, and a preparation method therefor. The conductive liquid metal microparticle includes a core containing a liquid metal and a shell surrounding the core and containing a hydrogen-doped liquid metal oxide. Since the conductive ink includes the liquid metal microparticles, with the use of the conductive ink, it is possible to form a circuit line exhibiting metal conductivity, an insignificant change in resistance when deformation or mechanical damage occurs, stability of electric characteristics under extreme environment, and good adhesion to an elastic substrate.

公开(公告)号：US20230044133A1

公开(公告)日：2023-02-09

申请号：US17781139

申请日：2020-12-14

Applicant: POSTECH Research and Business Development Foundation

Inventor： Unyong JEONG ,  Veerapandian SELVARAJ

IPC: H05K1/02 ,  H05K1/09 ,  G01L1/22 ,  C08L23/08

Abstract: Proposed are a flexible electrode circuit capable of being foamed through 3D circuit printing, a strain sensor using the same, and a manufacturing method thereof. The flexible electrode circuit includes a flexible substrate and an electrode foamed on the flexible substrate. The electrode includes a conductive line layer and a passivation layer. The conductive line layer includes a matrix including an elastic polymer and a conductive line having conductive liquid metal microparticles dispersed in the matrix. The passivation layer includes a coating portion coated on the conductive line and having an elastic polymer.