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公开(公告)号：US20160171710A1
公开(公告)日：2016-06-16
申请号：US14566308
申请日：2014-12-10
Applicant: OmniVision Technologies, Inc.
Inventor： Robbert Emery
CPC classification number: G06K9/4609 , G06T7/12 , G06T7/181 , G06T2207/10024
Abstract: An edge detection method includes reading at least a portion of wide-band pixel signals generated by wide-band pixels of an image sensor. The image sensor also includes narrow-band pixels that generate narrow-band pixel signals that remain unread. The method also includes sending the wide-band pixel signals to an image signal processor, forming a partially-filled reference image based on data from the wide-band pixel signals; and applying an edge-forming technique to the partially-filled reference image to produce an edge map. An edge detection system includes a two-dimensional array of pixels having wide-band pixels and narrow-band pixels, an image signal processor for producing an edge map from a partially-filled reference image, and a readout circuit for generating the partially-filled reference image for the image signal processor. The partially-filled reference is based only on at least part of the wide-band pixels.
Abstract translation: 边缘检测方法包括读取由图像传感器的宽带像素生成的宽带像素信号的至少一部分。 图像传感器还包括窄带像素，其产生保持未读的窄带像素信号。 该方法还包括将宽带像素信号发送到图像信号处理器，基于来自宽带像素信号的数据形成部分填充的参考图像; 以及将边缘形成技术应用于部分填充的参考图像以产生边缘图。 边缘检测系统包括具有宽带像素和窄带像素的像素的二维阵列，用于从部分填充的参考图像产生边缘图的图像信号处理器和用于产生部分填充的参考图像的读出电路 图像信号处理器的参考图像。 部分填充的基准仅基于宽带像素的至少一部分。
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公开(公告)号：US20140306308A1
公开(公告)日：2014-10-16
申请号：US14249091
申请日：2014-04-09
Applicant: OmniVision Technologies, Inc.
Inventor： Raymond Wu , Robbert Emery
IPC: H01L27/146
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/1469 , H01L2924/0002 , H01L2924/00
Abstract: A wafer-level array camera includes (i) an image sensor wafer including an image sensor array, (ii) a spacer disposed on the image sensor wafer, and (iii) a lens wafer disposed on the spacer, wherein the lens wafer includes a lens array. A method for fabricating a plurality of wafer-level array cameras includes (i) disposing a lens wafer, including a plurality of lens arrays, on an image sensor wafer, including a plurality of image sensor arrays, to form a composite wafer and (ii) dicing the composite wafer to form the plurality of wafer-level array cameras, wherein each of the plurality of wafer-level array cameras includes a respective one of the plurality of lens arrays and a respective one of the plurality of image sensor arrays.
Abstract translation: 晶片级阵列相机包括（i）包括图像传感器阵列的图像传感器晶片，（ii）设置在图像传感器晶片上的间隔物，以及（iii）设置在间隔物上的透镜晶片，其中透镜晶片包括 镜头阵列 制造多个晶片级阵列相机的方法包括：（i）在包括多个图像传感器阵列的图像传感器晶片上设置包括多个透镜阵列的透镜晶片，以形成复合晶片，并且（ii ）切割所述复合晶片以形成所述多个晶片级阵列相机，其中所述多个晶片级阵列相机中的每一个都包括所述多个透镜阵列中的相应一个和所述多个图像传感器阵列中的相应一个。
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公开(公告)号：US09697434B2
公开(公告)日：2017-07-04
申请号：US14566308
申请日：2014-12-10
Applicant: OmniVision Technologies, Inc.
Inventor： Robbert Emery
CPC classification number: G06K9/4609 , G06T7/12 , G06T7/181 , G06T2207/10024
Abstract: An edge detection method includes reading at least a portion of wide-band pixel signals generated by wide-band pixels of an image sensor. The image sensor also includes narrow-band pixels that generate narrow-band pixel signals that remain unread. The method also includes sending the wide-band pixel signals to an image signal processor, forming a partially-filled reference image based on data from the wide-band pixel signals; and applying an edge-forming technique to the partially-filled reference image to produce an edge map. An edge detection system includes a two-dimensional array of pixels having wide-band pixels and narrow-band pixels, an image signal processor for producing an edge map from a partially-filled reference image, and a readout circuit for generating the partially-filled reference image for the image signal processor. The partially-filled reference is based only on at least part of the wide-band pixels.
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公开(公告)号：US09923008B2
公开(公告)日：2018-03-20
申请号：US14249091
申请日：2014-04-09
Applicant: OmniVision Technologies, Inc.
Inventor： Raymond Wu , Robbert Emery
IPC: H01L21/00 , H01L27/146
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/1469 , H01L2924/0002 , H01L2924/00
Abstract: A wafer-level array camera includes (i) an image sensor wafer including an image sensor array, (ii) a spacer disposed on the image sensor wafer, and (iii) a lens wafer disposed on the spacer, wherein the lens wafer includes a lens array. A method for fabricating a plurality of wafer-level array cameras includes (i) disposing a lens wafer, including a plurality of lens arrays, on an image sensor wafer, including a plurality of image sensor arrays, to form a composite wafer and (ii) dicing the composite wafer to form the plurality of wafer-level array cameras, wherein each of the plurality of wafer-level array cameras includes a respective one of the plurality of lens arrays and a respective one of the plurality of image sensor arrays.
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