公开(公告)号：US12237580B2

公开(公告)日：2025-02-25

申请号：US18321114

申请日：2023-05-22

Applicant: Movandi Corporation

Inventor： Ahmadreza Rofougaran ,  Alfred Grau Besoli ,  Seunghwan Yoon ,  Farid Shirinfar ,  Sam Gharavi ,  Michael Boers ,  Maryam Rofougaran ,  Enver Adas ,  Kartik Sridharan

IPC: H01Q19/06 ,  G02B27/09 ,  H01Q15/02 ,  H01Q21/00

Abstract: A communication device includes a system board that includes a plurality of chips. Each chip in plurality of chips includes a plurality of antennas. A system board cover coupled to system board includes a plurality of lenses. Each lens is configured to cover an antenna of plurality of antennas as a radome enclosure. Each lens includes a base and a first tubular membrane coupled to base. A second membrane is coupled to the first tubular membrane. A support structure is coupled to the first tubular membrane. The support structure facilitates coupling of plurality of lenses to system board cover. The system board cover includes a feeder array that includes a plurality of antenna elements that are positioned at a proximal distance from base of a lens and the proximal distance of the system board from the base of the lens is less than a focal length of the lens.

公开(公告)号：US12155113B2

公开(公告)日：2024-11-26

申请号：US18323002

申请日：2023-05-24

Applicant: Movandi Corporation

Inventor： Ahmadreza Rofougaran ,  Seunghwan Yoon ,  Alfred Grau Besoli ,  Farid Shirinfar ,  Sam Gharavi ,  Michael Boers ,  Maryam Rofougaran

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q21/06 ,  H01Q21/24 ,  H01Q3/26 ,  H01Q21/00 ,  H01Q25/00

Abstract: A phased array antenna panel includes a first plurality of antennas, a first radio frequency (RF) front end chip, a second plurality of antennas, a second RF front end chip, and a combiner RF chip. The first and second RF front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce respective first and second output signals based on the respective first and second input signals. The combiner RF chip can receive the first and second output signals and produce a power combined output signal that is a combination of powers of the first and second output signals. Alternatively, a power combiner can receive the first and second output signals and produce a power combined output signal, and the combiner RF chip can receive the power combined output signal.

公开(公告)号：US12046820B2

公开(公告)日：2024-07-23

申请号：US17943300

申请日：2022-09-13

Applicant: Movandi Corporation

Inventor： Seunghwan Yoon ,  Zhihui Wang ,  Franco De Flaviis ,  Alfred Grau Besoli ,  Kartik Sridharan ,  Ahmadreza Rofougaran ,  Michael Boers ,  Sam Gharavi ,  Donghyup Shin ,  Farid Shirinfar ,  Stephen Wu ,  Maryam Rofougaran

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q21/06

CPC classification number: H01Q21/065 ,  H01Q1/2283 ,  H01Q9/045 ,  H01Q21/0025

Abstract: An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

公开(公告)号：US11901635B2

公开(公告)日：2024-02-13

申请号：US17898706

申请日：2022-08-30

Applicant: Movandi Corporation

Inventor： Seunghwan Yoon ,  Franco De Flaviis ,  Alfred Grau Besoli ,  Kartik Sridharan ,  Ahmadreza Rofougaran ,  Michael Boers ,  Sam Gharavi ,  Donghyup Shin ,  Farid Shirinfar ,  Stephen Wu ,  Maryam Rofougaran

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q21/065 ,  H01Q1/2283 ,  H01Q9/045 ,  H01Q21/0025

Abstract: An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.

公开(公告)号：US11742586B2

公开(公告)日：2023-08-29

申请号：US17382398

申请日：2021-07-22

Applicant: Movandi Corporation

Inventor： Ahmadreza Rofougaran ,  Alfred Grau Besoli ,  Seunghwan Yoon ,  Farid Shirinfar ,  Sam Gharavi ,  Michael Boers ,  Maryam Rofougaran ,  Enver Adas ,  Kartik Sridharan

IPC: H01Q15/02 ,  H01Q3/26 ,  H01Q1/36 ,  H01Q19/06 ,  H01Q21/06

CPC classification number: H01Q15/02 ,  H01Q1/36 ,  H01Q3/2658 ,  H01Q19/062 ,  H01Q21/065

Abstract: A communication device includes a first lens, a feeder array, and control circuitry communicatively coupled to the feeder array. The first lens is associated with a defined shape, which further exhibits a defined distribution of dielectric constant. The feeder array includes a plurality of antenna elements that are positioned in proximity to the first lens. The control circuitry equalizes a distribution of a gain from the received first lens-guided beam of input RF signals across the feeder array and different scan directions of the plurality of antenna elements. The equalized distribution of gain is based on the defined distribution of dielectric constant within the first lens and the proximity of the feeder array to the first lens.

公开(公告)号：US11721910B2

公开(公告)日：2023-08-08

申请号：US17408606

申请日：2021-08-23

Applicant: Movandi Corporation

Inventor： Ahmadreza Rofougaran ,  Alfred Grau Besoli ,  Seunghwan Yoon ,  Farid Shirinfar ,  Sam Gharavi ,  Michael Boers ,  Maryam Rofougaran ,  Enver Adas ,  Kartik Sridharan

IPC: H01Q15/02 ,  H01Q19/06 ,  G02B27/09 ,  H01Q21/00

CPC classification number: H01Q19/062 ,  G02B27/0955 ,  H01Q15/02 ,  H01Q21/0006

Abstract: A communication device includes a lens having a defined shape. A feeder array comprising a plurality of antenna elements that are positioned in a specified proximal distance from the lens to receive a lens-guided beam of input radio frequency (RF) signals through the lens. The specified proximal distance is less than a focal length of the lens. The lens covers the feeder array as a radome enclosure. A distribution of a gain from the received lens-guided beam of input RF signals is substantially equalized from a radiation surplus region to a radiation deficient region of the feeder array to increase at least a reception sensitivity of the plurality of antenna elements for at least the lens-guided beam of input RF signals, based on the defined shape of the lens and the specified proximal distance of the feeder array to the lens.

公开(公告)号：US11664884B2

公开(公告)日：2023-05-30

申请号：US17863874

申请日：2022-07-13

Applicant: Movandi Corporation

Inventor： Sam Gharavi ,  Ahmadreza Rofougaran ,  Michael Boers ,  Seunghwan Yoon ,  Kartik Sridharan ,  Donghyup Shin ,  Farid Shirinfar ,  Stephen Wu ,  Maryam Rofougaran

IPC: H04L5/14 ,  H04B7/155 ,  H04B7/204 ,  H04B7/165 ,  H04W52/24 ,  H04B7/06 ,  H04B17/318 ,  H04B7/0413 ,  H04B7/15 ,  H04W52/46 ,  H04L5/00

CPC classification number: H04B7/15514 ,  H04B7/0413 ,  H04B7/0617 ,  H04B7/15 ,  H04B7/1555 ,  H04B7/165 ,  H04B7/2041 ,  H04B17/318 ,  H04W52/245 ,  H04W52/46 ,  H04L5/0023 ,  H04L5/14

Abstract: A device includes a primary sector and secondary sectors communicatively coupled to the primary sector. The processor included in the primary sector is configured to down convert a Radio Frequency (RF) signals with a first frequency to an analog baseband (IQ) signal with a second frequency, and receive a second digital baseband signal that comprises a first digital baseband signal and a digital echo signal. The first digital baseband signal comprises a training sequence signal. Further, the processor estimates a plurality of filter taps of the FIR filter based on the digital echo signal and estimate the digital echo signal in the received second digital baseband signal based on the first digital baseband signal and the plurality of filter taps of the FIR filter. The estimated digital echo signal is removed from at least one current digital baseband signal based on the down conversion of the RF signals.

公开(公告)号：US11659409B2

公开(公告)日：2023-05-23

申请号：US17243747

申请日：2021-04-29

Applicant: Movandi Corporation

Inventor： Ahmadreza Rofougaran ,  Sam Gharavi ,  Kartik Sridharan ,  Michael Boers ,  Seunghwan Yoon ,  Donghyup Shin ,  Farid Shirinfar ,  Stephen Wu ,  Maryam Rofougaran

IPC: H04W16/28 ,  H04B3/23 ,  H04B7/0408 ,  H04B7/06 ,  H04W24/02 ,  H01Q1/24 ,  H03F3/60 ,  H03G3/30

CPC classification number: H04W16/28 ,  H01Q1/242 ,  H03F3/602 ,  H04B3/232 ,  H04B7/0408 ,  H04B7/0695 ,  H04W24/02 ,  H03G3/3052

Abstract: A system, in an active reflector device, adjusts a first amplification gain of each of a plurality of radio frequency (RF) signals received at a receiver front-end from a first equipment via a first radio path of an NLOS radio path. A first phase shift is performed on each of the plurality of RF signals with the adjusted first amplification gain. A combination of the plurality of first phase-shifted RF signals is split at a transmitter front-end. A second phase shift on each of the split first plurality of first phase-shifted RF signals is performed. The plurality of RF signals as a directed beam is transmitted to a second equipment via a second radio path of the NLOS radio path.

公开(公告)号：US11616564B2

公开(公告)日：2023-03-28

申请号：US17863874

申请日：2022-07-13

Applicant: Movandi Corporation

Inventor： Sam Gharavi ,  Ahmadreza Rofougaran ,  Michael Boers ,  Seunghwan Yoon ,  Kartik Sridharan ,  Donghyup Shin ,  Farid Shirinfar ,  Stephen Wu ,  Maryam Rofougaran

IPC: H04L5/14 ,  H04B7/155 ,  H04B7/204 ,  H04B7/165 ,  H04W52/24 ,  H04B7/06 ,  H04B17/318 ,  H04B7/0413 ,  H04B7/15 ,  H04W52/46 ,  H04L5/00

Abstract: A device includes a primary sector and secondary sectors communicatively coupled to the primary sector. The processor included in the primary sector is configured to down convert a Radio Frequency (RF) signals with a first frequency to an analog baseband (IQ) signal with a second frequency, and receive a second digital baseband signal that comprises a first digital baseband signal and a digital echo signal. The first digital baseband signal comprises a training sequence signal. Further, the processor estimates a plurality of filter taps of the FIR filter based on the digital echo signal and estimate the digital echo signal in the received second digital baseband signal based on the first digital baseband signal and the plurality of filter taps of the FIR filter. The estimated digital echo signal is removed from at least one current digital baseband signal based on the down conversion of the RF signals.

公开(公告)号：US11552401B2

公开(公告)日：2023-01-10

申请号：US17329276

申请日：2021-05-25

Applicant: Movandi Corporation

Inventor： Seunghwan Yoon ,  Ahmadreza Rofougaran ,  Sam Gharavi ,  Kartik Sridharan ,  Donghyup Shin ,  Farid Shirinfar ,  Stephen Wu ,  Maryam Rofougaran ,  Alfred Grau Besoli ,  Enver Adas

IPC: H01Q1/24 ,  H01Q13/02 ,  H01Q21/00 ,  H01Q13/06 ,  H01Q21/24 ,  H01Q1/22 ,  H01Q21/06

Abstract: An antenna system includes a first substrate, a plurality of chips and a waveguide antenna element based beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. The first pin includes a first and a second current path, the first current path being longer than the second current path. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells.