公开(公告)号：US20220229091A1

公开(公告)日：2022-07-21

申请号：US17360260

申请日：2021-06-28

Applicant: Lumentum Operations LLC

Inventor： Sean BURNS ,  Raman SRINIVASAN ,  Lucas MORALES ,  Tian SHI ,  Yuanzhen ZHUANG ,  Cho-Shuen HSIEH ,  Albert HUANG

IPC: G01R1/073 ,  G01R1/067

Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

公开(公告)号：US20210325451A1

公开(公告)日：2021-10-21

申请号：US16917124

申请日：2020-06-30

Applicant: Lumentum Operations LLC

Inventor： Yuanzhen ZHUANG ,  Lucas MORALES ,  Raman SRINIVASAN ,  Sean BURNS ,  Siu Kwan CHEUNG ,  Tian SHI ,  Tao LI

IPC: G01R31/28

Abstract: A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.