公开(公告)号：US11885830B2

公开(公告)日：2024-01-30

申请号：US17360260

申请日：2021-06-28

Applicant: Lumentum Operations LLC

Inventor： Sean Burns ,  Raman Srinivasan ,  Lucas Morales ,  Tian Shi ,  Yuanzhen Zhuang ,  Cho-Shuen Hsieh ,  Albert Huang

IPC: G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07342 ,  G01R1/06761

Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.