公开(公告)号：US20250155204A1

公开(公告)日：2025-05-15

申请号：US18945926

申请日：2024-11-13

Applicant: LG Electronics Inc.

Inventor： Heegyu MAENG ,  Yohan LEE ,  Jiwon CHOI ,  Sangwon CHO ,  Taegyun PARK ,  Juhyok KIM

IPC: F28F9/02 ,  F28F1/10

Abstract: A heat exchanger and a clothing processing equipment includes first to third heat exchangers. A refrigerant discharged from the first heat exchanger is supplied to a lower portion of the second heat exchanger, the refrigerant heat-exchanged in the second heat exchanger is discharged to an upper portion of the second heat exchanger, the refrigerant discharged from the second heat exchanger is supplied to an upper portion of the third heat exchanger, and the refrigerant heat-exchanged in the third heat exchanger is discharged to a lower portion of the third heat exchanger.

公开(公告)号：US20210404672A1

公开(公告)日：2021-12-30

申请号：US16622634

申请日：2018-05-15

Applicant: LG ELECTRONICS INC. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Yohan LEE ,  Bongjun KIM ,  Sehyeon KIM ,  Jaeyoung KIM ,  Minwoo JEONG ,  Hyungjin SUNG ,  Jaebok LEE ,  Sunggoon PARK

IPC: F24F1/32 ,  F25B41/40

Abstract: A flow disturbance apparatus includes: a refrigerant pipe having a flow space in which refrigerant flows; and at least one disturbance member disposed inside the refrigerant pipe that is vibrated by the flow of refrigerant in the refrigerant pipe to disturb the refrigerant flowing in the refrigerant pipe.

公开(公告)号：US20250154712A1

公开(公告)日：2025-05-15

申请号：US18945905

申请日：2024-11-13

Applicant: LG Electronics Inc.

Inventor： Jiwon CHOI ,  Yohan LEE ,  Heegyu MAENG ,  Sangwon CHO ,  Taegyun PARK ,  Juhyok KIM

IPC: D06F58/20 ,  D06F58/24 ,  F28D21/00

Abstract: A clothing processing equipment includes a drum configured to accommodate laundry, a heat pump, and an air flow path defined between the heat pump and the drum, where the air flow path is configured to guide air circulating through the drum. The heat pump includes an evaporator, a compressor, a condenser, and an expansion valve and is configured to apply heat to air circulating through the drum. The condenser includes condensation refrigerant tubes configured to receive refrigerant and a condensation fin configured to conduct heat from the condensation refrigerant tubes. The evaporator includes evaporation refrigerant tubes configured to receive the refrigerant and an evaporation fin configured to conduct heat to the evaporation refrigerant tubes. The condensation refrigerant tubes define channels that are configured to carry the refrigerant. A cross-sectional area of each channel is less than a cross-sectional area of each evaporation refrigerant tube.

公开(公告)号：US20240230237A1

公开(公告)日：2024-07-11

申请号：US18405863

申请日：2024-01-05

Applicant: LG Electronics Inc.

Inventor： Jiwon CHOI ,  Yohan LEE ,  Taegyun PARK

IPC: F28D1/053 ,  F28F1/32

CPC classification number: F28D1/05391 ,  F28F1/32 ,  F28D2021/0068

Abstract: A heat exchanger includes a main heat exchanger configured to perform heat exchange between refrigerant and air and to define a first heat exchange surface and an auxiliary heat exchanger configured to perform heat exchange between refrigerant discharged from the main heat exchanger and air and to define a second heat exchange surface. The first heat exchange surface has an area larger than the area of the second heat exchange surface.

公开(公告)号：US20220082338A1

公开(公告)日：2022-03-17

申请号：US17425009

申请日：2020-01-28

Applicant: LG ELECTRONICS INC.

Inventor： Jiwon CHOI ,  Hongseong KIM ,  Yohan LEE ,  Hanchoon LEE

IPC: F28F1/40 ,  F28F13/12 ,  F28D7/16

Abstract: A heat transfer pipe includes an outer pipe having a space therein and extending a first direction, a core disposed in the space inside the outer pipe, defining a refrigerant flow space through which a refrigerant flows between an inner surface of the outer pipe and the core, and extending in the first direction, and a resistor disposed in the refrigerant flow space and having a spiral shape with a central axis disposed to be parallel to the first direction.