公开(公告)号：US20250151484A1

公开(公告)日：2025-05-08

申请号：US18896406

申请日：2024-09-25

Applicant: LG ELECTRONICS INC.

Inventor： Naree KIM ,  Dongkyu LEE ,  Hongkey PARK ,  Sanggun LEE ,  Jeongsik CHOI

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: A micro LED module according to an embodiment of the present invention may include a substrate, a solder resist layer disposed on the substrate, an electrode electrically connected to the substrate, a micro semiconductor light emitting device disposed on the solder resist layer electrically connected to the electrode, a first coating layer disposed on the solder resist layer, and a second coating layer disposed on the first coating layer, wherein the top surface of the first coating layer may be disposed at a height equal to or lower than the height of the top surface of the micro semiconductor light emitting device.