公开(公告)号：US20240218592A1

公开(公告)日：2024-07-04

申请号：US18610450

申请日：2024-03-20

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Kyung Cheol Choi ,  Seung Yeop Choi ,  Seon Il Kwon

IPC: D06N3/18 ,  D06N3/00 ,  D06N3/04 ,  D06N3/12 ,  D06N3/14 ,  G09F21/02 ,  H10K77/10

CPC classification number: D06N3/18 ,  D06N3/0006 ,  D06N3/0081 ,  D06N3/042 ,  D06N3/123 ,  D06N3/128 ,  D06N3/14 ,  G09F21/026 ,  H10K77/111 ,  D06N2203/045 ,  D06N2203/061 ,  D06N2203/068 ,  D06N2205/20 ,  D06N2207/123 ,  D06N2209/106 ,  D06N2209/1635

Abstract: According to the present invention, there is provided a fabric substrate for mounting a light emitting element. The fabric substrate comprises a fabric layer including at least one fabric, a stress buffer layer that is disposed on the fabric layer and minimizes an occurrence of physical strain and stress caused by bending the fabric layer, and a flattening layer that is disposed on the stress buffer layer and provides a flat surface to allow a light emitting element to operate.

公开(公告)号：US20200149217A1

公开(公告)日：2020-05-14

申请号：US16683714

申请日：2019-11-14

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Kyung Cheol Choi ,  Seung Yeop Choi ,  Seon Il Kwon

IPC: D06N3/18 ,  B08B3/04 ,  D06N3/00 ,  G09F21/02 ,  D06N3/14 ,  D06N3/12 ,  D06N3/04

Abstract: According to the present invention, there is provided a fabric substrate for mounting a light emitting element. The fabric substrate includes a fabric layer including at least one fabric, a stress buffer layer that is disposed on the fabric layer and minimizes an occurrence of physical strain and stress caused by bending the fabric layer, and a flattening layer that is disposed on the stress buffer layer and provides a flat surface to allow a light emitting element to operate.