公开(公告)号：US10916575B2

公开(公告)日：2021-02-09

申请号：US16353301

申请日：2019-03-14

Applicant: Samsung Electronics Co., Ltd. ,  Korea Advanced Institute of Science and Technology

Inventor： Yang Ho Cho ,  Ki-Hun Jeong ,  Dong Kyung Nam ,  Kisoo Kim ,  Kyung-Won Jang

IPC: H01L27/146 ,  G02B7/00 ,  G02B7/02 ,  G02B5/00 ,  G02B3/00

Abstract: An image sensor and a method of manufacturing the image sensor are provided. The image sensor includes a block layer including an absorption layer and a transparent layer that are alternately stacked, a lens element is located below the block layer, and a sensing element is located to face the lens element.

公开(公告)号：US11818473B2

公开(公告)日：2023-11-14

申请号：US17159471

申请日：2021-01-27

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ki-Hun Jeong ,  Kisoo Kim ,  Kyung-Won Jang ,  Sang-In Bae

IPC: H04N5/335 ,  H04N23/951 ,  G02B3/00 ,  G02B13/00 ,  H04N23/55

CPC classification number: H04N23/951 ,  G02B3/0037 ,  G02B13/0085 ,  H04N23/55

Abstract: An ultrathin camera device is provided. The ultrathin camera device comprises an optical module including a microlens array in which microlenses are arranged, an image sensor that outputs electrical image signals by sensing light coming through the microlens array, spacers that form a focal length by separating the optical module from the image sensor, and a processor that outputs a final image by reconstructing array images generated from the image signals with a designated imaging process depending on a distance at which the object is located. Here, each microlens convexly protrudes toward the image sensor.