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公开(公告)号：US20220229233A1
公开(公告)日：2022-07-21
申请号：US17576212
申请日：2022-01-14
Applicant: Korea Advanced Institute of Science and Technology , Gwangju Institute of Science and Technology
Inventor： Hyo-Hoon Park , Jong-Bum You , Dong-Eun Yoo , Ju-Beom Lee , In Ki Kim , Tae Joon Seok , Geumbong Kang , Hyeonho Yoon , Nam-Hyun Kwon
Abstract: Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.
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公开(公告)号：US11640030B2
公开(公告)日：2023-05-02
申请号：US17576212
申请日：2022-01-14
Applicant: Korea Advanced Institute of Science and Technology , Gwangju Institute of Science and Technology
Inventor： Hyo-Hoon Park , Jong-Bum You , Dong-Eun Yoo , Ju-Beom Lee , In Ki Kim , Tae Joon Seok , Geumbong Kang , Hyeonho Yoon , Nam-Hyun Kwon
Abstract: Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.
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公开(公告)号：US10193224B2
公开(公告)日：2019-01-29
申请号：US15543903
申请日：2015-11-16
Inventor： Kyoungsik Yu , Jong-Bum You , Jun-Su Baek , Jung Hoon Park
Abstract: A device forming a photonic phased array antenna includes a low-refractive dielectric substrate, a nano-structured thin film formed on the low-refractive dielectric structure, and a high-refractive semiconductor waveguide formed over the low-refractive dielectric substrate and configured to operate in a single mode in the nano-structured thin film, wherein an antenna radiating a phase-modulated light wave to a free space is miniaturized to concentrate a radiated beam of a phased array antenna and to widen a scanning range.
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公开(公告)号：US20180006372A1
公开(公告)日：2018-01-04
申请号：US15543903
申请日：2015-11-16
Inventor： Kyoungsik Yu , Jong-Bum You , Jun-Su Baek , Jung Hoon Park
CPC classification number: H01Q3/30 , G02B6/00 , G02B6/1223 , H01Q21/0068 , H01Q21/061 , H01Q21/08
Abstract: A device forming a photonic phased array antenna includes a low-refractive dielectric substrate, a nano-structured thin film formed on the low-refractive dielectric structure, and a high-refractive semiconductor waveguide formed over the low-refractive dielectric substrate and configured to operate in a single mode in the nano-structured thin film, wherein an antenna radiating a phase-modulated light wave to a free space is miniaturized to concentrate a radiated beam of a phased array antenna and to widen a scanning range.
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