公开(公告)号：US20200211879A1

公开(公告)日：2020-07-02

申请号：US16727248

申请日：2019-12-26

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Keon Jae LEE ,  Han Eol LEE ,  Tae Jin KIM ,  Jung Ho SHIN ,  Sang Hyun PARK

IPC: H01L21/677 ,  H01L21/683 ,  H01L33/62 ,  B65G47/91

Abstract: The present disclosure provides a method for transfer and assembly of RGB micro-light-emitting diodes using vacuum suction force whereby the vacuum state of micrometer-sized adsorption holes to which micro-light-emitting diodes formed on a mother substrate or a temporary substrate are bonded is controlled selectively, so that only the micro-light-emitting diode devices desired to be detached from the mother substrate or the temporary substrate are detached from the mother substrate or the temporary substrate using vacuum suction force and then transferred to a target substrate