公开(公告)号：US20170365495A1

公开(公告)日：2017-12-21

申请号：US15277792

申请日：2016-09-27

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Jing G. Zhou ,  Ran Liu

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67253 ,  H01L21/67248 ,  H01L21/68764

Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.

公开(公告)号：US11823925B2

公开(公告)日：2023-11-21

申请号：US16665960

申请日：2019-10-28

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Jing G Zhou ,  Ran Liu

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67253 ,  H01L21/67248 ,  H01L21/68764

Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.

公开(公告)号：US10460966B2

公开(公告)日：2019-10-29

申请号：US15277792

申请日：2016-09-27

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Jing G. Zhou ,  Ran Liu

IPC: H05K5/06 ,  H01L21/67 ,  H01L21/687

Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.