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公开(公告)号:US20250053096A1
公开(公告)日:2025-02-13
申请号:US18231181
申请日:2023-08-07
Applicant: KLA Corporation
Inventor: Houssam Chouaib , Tianrong Zhan , Jonathan Iloreta , Teng Gu , Andrei V. Shchegrov
IPC: G03F7/00
Abstract: Methods and systems for generating measurement models of complex semiconductor structures based on re-useable, parametric models are presented herein. In some embodiments, the re-useable, parametric models enable measurement of high aspect ratio (HAR) structures having complex shape profiles. In these embodiments, a re-useable, parametric model includes multiple geometric sections each characterized by a different shape profile. Each shape profile is parameterized by at least one shape parameter. In a further aspect, at least one of the multiple geometric sections includes a plurality of subsections. In some other embodiments, the re-useable, parametric models enable measurement of nanowire based semiconductor structures. The re-useable, parametric models described herein are useful for generating measurement models for both optical metrology and x-ray metrology, e.g., soft x-ray metrology and hard x-ray metrology. The resulting measurement models yield more accurate measurement results with improved robustness.
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公开(公告)号:US20240377758A1
公开(公告)日:2024-11-14
申请号:US18196219
申请日:2023-05-11
Applicant: KLA Corporation
Inventor: Houssam Chouaib , HaoMiao Chang , Teng Gu , Tianrong Zhan , Andrew Lagodzinski , Zhengquan Tan
IPC: G03F7/00
Abstract: An inspection system includes a controller including a memory maintaining program instructions and one or more processors configured to execute the program instructions. The program instructions cause the one or more processors to generate a geometric model of a structure of a sample, generate an optical response function model of the structure of the sample to illumination based at least in part on the geometric model, receive measured data from a detector, generate a parametric sub-structure model based on at least the optical response function model and the measured data, and extract one or more parameters of the structure based on the measured data.
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