CHIP SYSTEM AND ELECTRONIC DEVICE

    公开(公告)号:US20250014976A1

    公开(公告)日:2025-01-09

    申请号:US18889286

    申请日:2024-09-18

    Abstract: A chip system includes a BGA chip, a PCB, a signal source module, and a detection module. A function pin of the BGA chip is soldered to a function solder pad of the PCB by a first solder ball and a detection pin of the BGA chip is soldered to a detection solder pad of the PCB by a second solder ball. A designed life of the second solder ball is shorter than a designed life of the first solder ball. A detection path is formed between the BGA chip and the PCB and includes the second solder ball. The signal source module is configured to send a detection signal to the detection module through the detection path to determine a status of the detection path based on the received detection signal.

    Certificate Revocation List Updating Method and Related Device

    公开(公告)号:US20220294649A1

    公开(公告)日:2022-09-15

    申请号:US17831136

    申请日:2022-06-02

    Abstract: A certificate revocation list updating method includes determining by a first road side unit (RSU), based on a first certificate revocation list stored by the first RSU, that a certificate used by a first on board unit (OBU) in a coverage area of the first RSU is revoked, sending, by the first RSU, a first notification message to one or more OBUs in the coverage area of the first RSU, where the first notification message notifies the one or more OBUs to update a certificate revocation list.

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