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公开(公告)号:US10901472B2
公开(公告)日:2021-01-26
申请号:US16473838
申请日:2016-12-29
Applicant: Huawei Technologies Co., Ltd.
Inventor: Wei Li , Chunyang Chen , Baochun Chen , Zhiguo Zhang , Quanming Li
Abstract: A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.
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公开(公告)号:US11016546B2
公开(公告)日:2021-05-25
申请号:US16473838
申请日:2016-12-29
Applicant: Huawei Technologies Co., Ltd.
Inventor: Wei Li , Chunyang Chen , Baochun Chen , Zhiguo Zhang , Quanming Li
Abstract: A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.
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公开(公告)号:US20200150732A1
公开(公告)日:2020-05-14
申请号:US16473838
申请日:2016-12-29
Applicant: Huawei Technologies Co., Ltd.
Inventor: Wei Li , Chunyang Chen , Baochun Chen , Zhiguo Zhang , Quanming Li
Abstract: A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.
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