公开(公告)号：US20160268993A1

公开(公告)日：2016-09-15

申请号：US15165299

申请日：2016-05-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lanping GONG ,  Zhen YUAN

IPC: H03H7/46

CPC classification number: H03H7/463 ,  H03H7/48 ,  H03H11/36

Abstract: Embodiments of the present application provide an intra-band combiner-divider and a multisystem combining platform, and the intra-band combiner-divider includes: a first-level duplexer, an intra-band combination unit, an intra-band division unit, and a second-level duplexer. In the embodiments of the present application, two ends of the intra-band combiner-divider are connected to the first-level duplexer and the second-level duplexer, so that the intra-band combiner-divider can separately process uplink and downlink signals, thereby reducing PIM of a communication system and improving receiver sensitivity of a base station.

Abstract translation: 本申请的实施例提供了一种带内组合分配器和多系统组合平台，并且带内组合器分配器包括：第一级双工器，带内组合单元，带内分离单元和 一个二级双工器。 在本申请的实施例中，带内组合器分配器的两端连接到第一级双工器和第二级双工器，使得带内组合器分配器可以分别处理上行链路和下行链路信号， 从而减少通信系统的PIM并提高基站的接收灵敏度。