公开(公告)号：US20190220434A1

公开(公告)日：2019-07-18

申请号：US16365677

申请日：2019-03-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fen DAI ,  Xing HU ,  Jun XU ,  Yuangang WANG

IPC: G06F13/40 ,  G06F13/16 ,  H04L12/26

Abstract: A memory extensible chip (200) is provided. The chip (200) includes a substrate (240), and a processor (230), a first memory module set (210), and a second memory module set (220) that are integrated on the substrate (240). The processor (230) communicates with at least one memory module in the first memory module set (210) using a first communications interface (250), and the processor (230) communicates with at least one memory module in the second memory module set (220) using a second communications interface (260). A memory module in the first memory module set (210) communicates with a memory module in the second memory module set (220) using a substrate network, where the substrate network is a communications network located inside the substrate (240). In this way, the processor (230) can access a memory module in the first memory module set (210) by using the second memory module set (220).