SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF A CHASSIS-COUPLED MODULAR MOBILE ELECTRONIC DEVICE
    3.
    发明申请
    SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF A CHASSIS-COUPLED MODULAR MOBILE ELECTRONIC DEVICE 审中-公开
    一种联机模块化移动电子设备的热管理系统与方法

    公开(公告)号:US20150286259A1

    公开(公告)日:2015-10-08

    申请号:US14680955

    申请日:2015-04-07

    Applicant: Google, Inc.

    CPC classification number: G06F1/206 G06F1/203

    Abstract: Systems and methods for thermal management of a mobile electronic device. During operation of a modular mobile electronic device that is coupled to one or more modules via respective module interfaces of the electronic device, a thermal controller of the electronic device is used to update at least one system thermal goal based on a change for a module thermal model for at least one module coupled to the electronic device. A determination is made as to whether the updated at least one system thermal goal is satisfied based on thermal data provided by a plurality of thermal sensors arranged at locations associated with the electronic device. Responsive to a determination that the updated at least one system thermal goal is not satisfied, the thermal controller controls heat transfer to satisfy the updated at least one thermal goal.

    Abstract translation: 用于移动电子设备的热管理的系统和方法。 在通过电子设备的相应模块接口耦合到一个或多个模块的模块化移动电子设备的操作期间,电子设备的热控制器用于基于模块热量的改变来更新至少一个系统热目标 模型,用于耦合到电子设备的至少一个模块。 基于布置在与电子设备相关联的位置处的多个热传感器提供的热数据,确定是否满足更新的至少一个系统热目标。 响应于确定更新的至少一个系统热目标不被满足,热控制器控制热传递以满足更新的至少一个热目标。

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