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    Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereof
    1.
    发明授权
    Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereof 有权
    使用凹凸结构制造转印印刷基板的方法，由此制造的转印印刷基板及其应用

    公开(公告)号：US09005709B2

    公开(公告)日：2015-04-14

    申请号：US13712026

    申请日：2012-12-12

    申请人： Gwangju Institute of Science and Technology

    发明人： Heung Cho Ko ,  Seok Ho Kim ,  Jongwon Yoon ,  Young Kyu Hwang ,  Su Ok Yun ,  Hun Soo Jang ,  Seong-Ju Park ,  Hyun-A Cho ,  Byeong-Il Noh ,  Jaeyi Chun

    IPC分类号： B32B38/10 ,  B32B3/30 ,  B41C1/00 ,  G03F7/00 ,  B82Y10/00 ,  B82Y40/00 ,  B41N1/12

    CPC分类号： B41N1/12 ,  B32B3/30 ,  B32B38/10 ,  B41C1/00 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24521 ,  Y10T428/24529

    摘要： A method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. This process of manufacturing provides a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.

    摘要翻译： 一种使用凹凸结构和由此制造的用于转印的基板的转印用基板的制造方法。 该方法包括制备其上形成有凹凸结构的处理基板; 沿着处理衬底上的凹凸结构形成牺牲层; 在其上形成有牺牲层的处理基板上涂覆聚合物以形成具有填充凹凸结构的凹部的凸块的聚合物基板; 以及从所述处理基板去除所述牺牲层。 基板包括其上形成有凹凸结构的处理基板; 以及放置在凹凸结构上并具有填充处理基板的凹凸结构的凹部的凸块的聚合物基板。 该制造方法提供了一种在超薄基材上稳定地进行的装置，并且可以在转印印刷工艺中确保高度的对准和高转印率。