Abstract:
Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced. The co-location of the electronics next to or proximal to the photodetector array also enables/facilitates programmable pixel configuration for optimal image quality.
Abstract:
A detector module for a radiation detector in a radiation imaging apparatus is provided. The detector module includes a detecting element array including a plurality of detecting elements arranged in a matrix form in first and second directions orthogonal to each other, the detecting element array configured to allow radiation to penetrate through spaces defined between the detecting elements, an electronic circuit arranged on a radiation emission side of the detecting element array, and a radiation shielding body arranged on a radiation incident side of the detecting element array. The radiation shielding body includes a base material having radiation permeability and formed with a plurality of grooves extending in the first direction at respective positions corresponding to spaces between the detecting elements in the second direction, and a plurality of radiation shielding materials each inserted in a respective groove of the plurality of grooves.
Abstract:
A method for manufacturing a high melting point metal based object includes providing pure high melting point metal based powder, fabricating a green object from the powder, by way of a laser sintering technique, providing infiltration treatment to the green object, and providing heating pressure treatment to the green object. The temperature to the green object is controlled to the re-sintering point of the green object.
Abstract:
A method for manufacturing a high melting point metal based object includes providing pure high melting point metal based powder, fabricating a green object from the powder, by way of a laser sintering technique, providing infiltration treatment to the green object, and providing heating pressure treatment to the green object The temperature to the green object is controlled to the re-sintering point of the green object.
Abstract:
CT detector modules are disclosed that include a module frame and a plurality of tileable detector sensors positioned on the module frame. Each of the tileable detector sensors includes an array of detector elements and a mounting structure directly or indirectly coupled to the detector elements to provide for a mounting and alignment of the detector sensor to the module frame. The mounting structure includes an alignment plate positioned generally opposite the array of detector elements, with the alignment plate having alignment pins forming a datum structure to align the detector sensor on the module frame and one or more threaded bosses configured to receive a fastener therein that secures the detector sensor to the module frame. The module frame includes keyed features that receive the alignment pins when the detector sensors are mounted on the module frame, so as to align the detector sensors on the module frame.
Abstract:
An x-ray detector assembly is disclosed that includes a mounting substrate having a plurality of electrical contacts, the mounting substrate comprising one of an integrated circuit and a circuit board. The x-ray detector assembly also includes a first electrode patterned on a first portion of a top surface of the mounting substrate, wherein the first electrode is electrically coupled to the plurality of electrical contacts. An organic photodiode layer is formed atop the first electrode and has a bottom surface electrically connected to the first electrode. A second electrode is coupled to a top surface of the organic photodiode layer and a scintillator is coupled to the second electrode.
Abstract:
A collimator for an imaging system includes a first region comprising a first one-dimensional array of apertures along a channel direction, and a second region comprising a second one-dimensional array of apertures along the channel direction, wherein an aspect ratio of the apertures of the first region is greater than an aspect ratio of the second region.
Abstract:
A multi-beam laser scanning system comprising a laser, a beam splitter, a first scanning unit, a second scanning unit, and a control unit is disclosed herein. The laser is used for generating an initial laser beam. The beam splitter is used for splitting the initial laser beam into a first laser beam and a second laser beam. The first scanning unit is used for deflecting the first laser beam along a desired direction. The second scanning unit is used for deflecting the second laser beam along a desired direction. The control unit is coupled to the first and second scanning units and arranged to output control signals to the first and second scanning units to manufacture an object.
Abstract:
A method for manufacturing a high melting point metal based object includes providing pure high melting point metal based powder, fabricating a green object from the powder, by way of a laser sintering technique, providing infiltration treatment to the green object, and providing heating pressure treatment to the green object. The temperature to the green object is controlled to the re-sintering point of the green object.
Abstract:
An x-ray detector assembly is disclosed that includes a mounting substrate having a plurality of electrical contacts, the mounting substrate comprising one of an integrated circuit and a circuit board. The x-ray detector assembly also includes a first electrode patterned on a first portion of a top surface of the mounting substrate, wherein the first electrode is electrically coupled to the plurality of electrical contacts. An organic photodiode layer is formed atop the first electrode and has a bottom surface electrically connected to the first electrode. A second electrode is coupled to a top surface of the organic photodiode layer and a scintillator is coupled to the second electrode.