公开(公告)号：US11171048B2

公开(公告)日：2021-11-09

申请号：US16816695

申请日：2020-03-12

申请人： FEI Company

发明人： Sean O. Morgan-Jones ,  Sophia E. Weeks ,  Peter D. Carleson

IPC分类号： H01L21/768 ,  H01L21/02 ,  G03F1/84

摘要： Adaptive endpoint detection is applied to delayering of a multi-layer sample utilizing a combination of dynamic and predetermined parameters. Tuned predetermined parameters, varying between layers of the sample, allow automated operation across multiple sites of a device. A semiconductor logic device is described, having a zone of thick metal layers and a zone of thin metal layers. The described techniques can be integrated with analysis operations and can be applied across a wide range of device types and manufacturing processes.

公开(公告)号：US20210287938A1

公开(公告)日：2021-09-16

申请号：US16816695

申请日：2020-03-12

申请人： FEI Company

发明人： Sean O. Morgan-Jones ,  Sophia E. Weeks ,  Peter D. Carleson

IPC分类号： H01L21/768 ,  G03F1/84 ,  H01L21/02

摘要： Adaptive endpoint detection is applied to delayering of a multi-layer sample utilizing a combination of dynamic and predetermined parameters. Tuned predetermined parameters, varying between layers of the sample, allow automated operation across multiple sites of a device. A semiconductor logic device is described, having a zone of thick metal layers and a zone of thin metal layers. The described techniques can be integrated with analysis operations and can be applied across a wide range of device types and manufacturing processes.