公开(公告)号：US20190219760A1

公开(公告)日：2019-07-18

申请号：US16215416

申请日：2018-12-10

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Duk Jun KIM ,  Young-Ho KO ,  Dong-Young KIM ,  Jong-Hoi KIM ,  Yongsoon BAEK ,  Jung-Ho SONG ,  Dong Hyo LEE ,  Byung-Seok CHOI ,  Won Seok HAN

IPC: G02B6/122

CPC classification number: G02B6/122 ,  G02B2006/12152

Abstract: An optical waveguide structure includes a substrate and a core structure disposed on the substrate. The substrate includes a first waveguide region, a second waveguide region, and a transition region between the first waveguide region and the second waveguide region. The core structure includes first core segments arranged in a first direction and a second direction crossing the first direction on the transition region. The core structure includes second core segments arranged in the first direction and the second direction on the second waveguide region. The first direction and the second direction are parallel to a top surface of the substrate.

公开(公告)号：US20180143463A1

公开(公告)日：2018-05-24

申请号：US15596566

申请日：2017-05-16

Applicant: Electronics and Telecommunications Research Institute

Inventor： Young-Tak HAN ,  Sang Ho PARK ,  Yongsoon BAEK ,  Jang Uk SHIN ,  Dong Hyo LEE ,  Dong-Hun LEE

IPC: G02F1/025 ,  H01L23/00

CPC classification number: G02F1/025 ,  G02F2001/0157 ,  G02F2201/58 ,  H01L24/49 ,  H01L2224/4912

Abstract: Provided is an optical transmitter module. The optical transmitter module includes a substrate, a ground layer disposed on the substrate, an electro-absorption modulated laser (EML) chip disposed on the ground layer to generate an modulated optical signal, a ground structure disposed on the EML chip and electrically connected to the ground layer, a matching resistor disposed on the ground structure, and a first bonding wire disposed between the EML chip and the matching resistor to electrically connect the EML chip to the matching resistor.