公开(公告)号：US11618109B2

公开(公告)日：2023-04-04

申请号：US17364128

申请日：2021-06-30

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Gwang-Mun Choi ,  Yong Sung Eom ,  Kwang-Seong Choi ,  Jiho Joo ,  Chanmi Lee ,  Ki Seok Jang

IPC: B23K35/00 ,  B23K35/36 ,  B23K35/40 ,  B23K35/02

Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.

公开(公告)号：US12206056B2

公开(公告)日：2025-01-21

申请号：US17399754

申请日：2021-08-11

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kwang-Seong Choi ,  Yong Sung Eom ,  Jiho Joo ,  Gwang-Mun Choi ,  Seok-Hwan Moon ,  Chanmi Lee ,  Ki Seok Jang

IPC: H01L33/62 ,  H01L23/00

Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.

公开(公告)号：US11677060B2

公开(公告)日：2023-06-13

申请号：US17228310

申请日：2021-04-12

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Jiho Joo ,  Yong Sung Eom ,  Gwang-Mun Choi ,  Kwang-Seong Choi ,  Chanmi Lee ,  Ki Seok Jang

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/56 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/27 ,  H01L24/81 ,  H01L24/83 ,  H01L33/56 ,  H01L25/0753 ,  H01L2224/2712 ,  H01L2224/2919 ,  H01L2224/8112 ,  H01L2224/8122 ,  H01L2224/83909 ,  H01L2924/0715 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.