公开(公告)号：US20210410312A1

公开(公告)日：2021-12-30

申请号：US17470465

申请日：2021-09-09

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Joel Richard Goergen ,  Sarma VMK Vedhanabhatla ,  Damaruganath Pinjala ,  Jatin Kohli ,  Robert Gregory Twiss

IPC: H05K7/14 ,  H05K7/20 ,  H05K7/02

Abstract: A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

公开(公告)号：US20200221596A1

公开(公告)日：2020-07-09

申请号：US16819399

申请日：2020-03-16

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rohit Dev Gupta ,  Joel Richard Goergen ,  Sarma VMK Vedhanabhatla ,  Damaruganath Pinjala ,  Jatin Kohli ,  Robert Gregory Twiss

IPC: H05K7/14 ,  H05K7/20 ,  H05K7/02

Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

公开(公告)号：US20190008066A1

公开(公告)日：2019-01-03

申请号：US15639968

申请日：2017-06-30

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rohit Dev Gupta ,  Joel Richard Goergen ,  Sarma VMK Vedhanabhatla ,  Damaruganath Pinjala ,  Jatin Kohli ,  Robert Gregory Twiss

IPC: H05K7/14 ,  H05K7/20 ,  H05K7/02

Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.