公开(公告)号：US20210223487A1

公开(公告)日：2021-07-22

申请号：US17301407

申请日：2021-04-01

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar PATEL ,  Kumar Satya Harinadh POTLURI ,  Jock T. BOVINGTON ,  Ashley J. MAKER

IPC: G02B6/38 ,  G02B6/28 ,  G02B6/26 ,  H04B10/25

Abstract: A fiber array unit (FAU) includes a substrate, a plurality of optical fibers, and a lid. The substrate includes: an optical window extending through a layer of non-transparent material, a plurality of grooves, and an alignment protrusion configured to mate with an alignment receiver. The plurality of optical fibers are disposed in the plurality of grooves. The alignment protrusion is configured to align the plurality of optical fibers with an external device when mated with the alignment receiver. The plurality of optical fibers is disposed between the lid and the substrate.

公开(公告)号：US20200044412A1

公开(公告)日：2020-02-06

申请号：US16052441

申请日：2018-08-01

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Ashley J. MAKER ,  Kumar Satya Harinadh POTLURI

IPC: H01S5/022 ,  G02B6/12 ,  G02B6/42

Abstract: A submount assembly comprises a first substrate having a first surface and an opposing second surface, wherein a plurality of first grooves are formed into the first substrate from the first surface. Each first groove is dimensioned to receive a portion of a respective optical fiber of a plurality of optical fibers, and to arrange the optical fiber with a predetermined first height relative to the first surface. The submount assembly further comprises a plurality of first conductive traces on a side of the first substrate corresponding to the first surface, and a semiconductor laser contacted with the first conductive traces. The semiconductor laser has a predetermined second height relative to the first surface. The submount assembly further comprises a plurality of second conductive traces at the second surface and a plurality of first vias extending through the first substrate from the first conductive traces to the second conductive traces.

公开(公告)号：US20190179079A1

公开(公告)日：2019-06-13

申请号：US15841005

申请日：2017-12-13

Applicant: Cisco Technology, Inc.

Inventor： Kumar Satya Harinadh POTLURI ,  Ashley J. MAKER ,  Vipulkumar PATEL

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/32 ,  G02B6/42 ,  G02B6/38

CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/325 ,  G02B6/3652 ,  G02B6/38 ,  G02B6/4212 ,  G02B6/422 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/428

Abstract: Embodiments herein describe a fiber array unit (FAU) configured to couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into a non-transparent layer that overlap with epoxy wells in the photonic chip. Moreover, the FAU may include a transparent substrate on which the non-transparent layer is disposed that permits UV light to pass therethrough. As such, during curing, UV light can be pass through the transparent substrate and through the optical windows in the non-transparent layer to cure the epoxy disposed between the FAU and the photonic chip.

公开(公告)号：US20190310431A1

公开(公告)日：2019-10-10

申请号：US15946930

申请日：2018-04-06

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar PATEL ,  Kumar Satya Harinadh POTLURI ,  Jock T. BOVINGTON ,  Ashley J. MAKER

IPC: G02B6/38 ,  G02B6/28 ,  G02B6/26 ,  H04B10/25

Abstract: Embodiments herein describe a fiber array unit (FAU) configured to optically couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into or completely through a non-transparent layer that overlap the epoxy disposed on the photonic chip. UV radiation can be emitted through the optical windows to cure the underlying epoxy. In one example, the windows can also be used for dispensing epoxy. In addition to the optical windows, the FAU can include alignment protrusions (e.g., frustums) which mate or interlock with respective alignment receivers in the photonic chip. Doing so may facilitate passive alignment of the optical fibers in the FAU to an optical interface in the photonic chip.