公开(公告)号：US11275211B2

公开(公告)日：2022-03-15

申请号：US16445038

申请日：2019-06-18

Applicant: Cisco Technology, Inc.

Inventor： Anthony D. Kopinetz ,  Ashley J. Maker ,  Jarrett S. Neiman

IPC: G02B6/30

Abstract: A method of manufacturing an optical apparatus comprises forming an unfinished endface of a fiber array unit (FAU) that provides an arrangement of one or more optical fibers. The one or more optical fibers terminate at the unfinished endface. The method further comprises optically aligning the FAU with an external light-carrying medium. The one or more optical fibers are optically coupled with the external light-carrying medium through the unfinished endface.

公开(公告)号：US12237643B2

公开(公告)日：2025-02-25

申请号：US17302964

申请日：2021-05-17

Applicant: Cisco Technology, Inc.

Inventor： Norbert Schlepple ,  Jock T. Bovington ,  Mary Nadeau ,  Mittu Pannala ,  Jarrett S. Neiman

IPC: H01S5/024 ,  H01S5/02 ,  H01S5/02326

Abstract: Heatsinking in laser devices may be improved via a device, including: a header disk having a first face with a circumference; a header post that is thermally conductive, and having: a second face connected to the first face coterminously with the circumference; a third face opposite to the second face; and a fourth face perpendicular to the second face and the third face; a lens holder, having a fifth face connected to the third face; and an optical subassembly connected to the fourth face and optically aligned with the lens holder. The device may also be understood to comprise: a header disk having a circumference; a header post that is thermally conductive, the header post having: an arc coterminous to a portion of the circumference; a mounting face, perpendicular to a plane in which the arc and the circumference are defined; and a bonding face perpendicular to the mounting face.

公开(公告)号：US10608404B2

公开(公告)日：2020-03-31

申请号：US15431840

申请日：2017-02-14

Applicant: Cisco Technology, Inc.

Inventor： Mary Nadeau ,  Jarrett S. Neiman ,  Mittu Pannala

IPC: H01S5/022 ,  H01S5/22 ,  H01S5/042

Abstract: A laser light source, a submount for a semiconductor laser, and a method of providing a laser light source are provided. The laser light source includes a submount with first and second electrical contacts thereon and a trench there-between. A semiconductor laser is bonded to the submount by bonding third and fourth electrical contacts of the laser to the first and second electrical contacts, respectively. The third and fourth electrical contacts of the laser are arranged on opposite side of a laser active stripe, which is arranged over the trench of the submount.