公开(公告)号：US11812585B2

公开(公告)日：2023-11-07

申请号：US17445470

申请日：2021-08-19

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Manigandan Boopalan ,  Arjun G. Jayaprakash ,  Parag Ghate

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  H05K7/20145 ,  H05K7/20836

Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.