公开(公告)号：US12185433B2

公开(公告)日：2024-12-31

申请号：US18197657

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H05B3/26 ,  H01L21/67 ,  H01L21/683

Abstract: A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.

公开(公告)号：US20230377930A1

公开(公告)日：2023-11-23

申请号：US18197657

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.

公开(公告)号：US20230380016A1

公开(公告)日：2023-11-23

申请号：US18197658

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H05B3/26

CPC classification number: H05B3/265

Abstract: A substrate support assembly includes a puck, comprising a heating element, a power distribution assembly, and an insulator comprising at least one of alumina or thermoplastic disposed between the puck and the power distribution assembly, wherein an electrical connection between the heating element and the power distribution assembly comprises a terminal and a conical washer.