公开(公告)号：US09691645B2

公开(公告)日：2017-06-27

申请号：US14820422

申请日：2015-08-06

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324

CPC classification number: H01L21/67103 ,  H01J37/32082 ,  H01J37/32357 ,  H01J37/32724 ,  H01L21/324 ,  H01L21/68742 ,  H01L21/68785

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

公开(公告)号：US20170040191A1

公开(公告)日：2017-02-09

申请号：US14820422

申请日：2015-08-06

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/687

CPC classification number: H01L21/67103 ,  H01J37/32082 ,  H01J37/32357 ,  H01J37/32724 ,  H01L21/324 ,  H01L21/68742 ,  H01L21/68785

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

Abstract translation: 工件保持器包括与圆盘相应的内部和外部部分热连通的圆盘，第一和第二加热装置以及与该冰球热连通的散热器。 第一和第二加热装置是可独立控制的，并且第一和第二加热装置与冰球的热连通比热盘与冰球热传递更大。 一种控制工件温度分布的方法包括使热交换流体流过散热器，以建立对圆盘的参考温度，将圆盘的径向内部和外部部分的温度升高到高于参考温度的第一和第二温度， 通过激活被设置成与圆盘的径向内部和外部热连通的相应的第一和第二加热装置，并将工件放置在冰球上。

公开(公告)号：US20230095095A1

公开(公告)日：2023-03-30

申请号：US17486616

申请日：2021-09-27

Applicant: Applied Materials, Inc.

Inventor： Saravanakumar Natarajan ,  Ryan Pakulski

IPC: H01J37/32 ,  H01L21/687

Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a plurality of apertures. The systems may include a plurality of lid stacks. The systems may include a plurality of substrate supports. The systems may include a plurality of peripheral valves. Each peripheral valve may be disposed in one of the processing regions. Each peripheral valve may include a bottom plate coupled with the chamber body. The peripheral valve may include a bellow. The bellow may be coupled with the bottom plate. The peripheral valve may include a sealing ring having a body defining a central aperture. A bottom surface of the body may be coupled with the bellow. The body may define a recess having a diameter greater than that of a support plate of a substrate support.

公开(公告)号：US11217462B2

公开(公告)日：2022-01-04

申请号：US16834109

申请日：2020-03-30

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

公开(公告)号：US20200273728A1

公开(公告)日：2020-08-27

申请号：US16834109

申请日：2020-03-30

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/324 ,  H01J37/32

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

公开(公告)号：US20190109025A1

公开(公告)日：2019-04-11

申请号：US16209581

申请日：2018-12-04

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/687 ,  H01L21/324

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

公开(公告)号：US10607867B2

公开(公告)日：2020-03-31

申请号：US16209581

申请日：2018-12-04

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324 ,  H01J37/32

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

公开(公告)号：US10147620B2

公开(公告)日：2018-12-04

申请号：US15581545

申请日：2017-04-28

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324 ,  H01J37/32

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

公开(公告)号：US20170229328A1

公开(公告)日：2017-08-10

申请号：US15581545

申请日：2017-04-28

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/67 ,  H01L21/687 ,  H01J37/32 ,  H01L21/324

CPC classification number: H01L21/67103 ,  H01J37/32082 ,  H01J37/32357 ,  H01J37/32724 ,  H01L21/324 ,  H01L21/68742 ,  H01L21/68785

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.